- Fortified with glass beads to maintain uniform bond line over the life of the device
- Eliminates die/component hotspots caused by incomplete heatsink contact seen with use of other thermal compounds
Additionally, a thermal pad requires a presssure mount with a narrow gap, while Carbon Black is designed for non-pressure-mounted components.
- Fortified with glass beads to maintain uniform bond line over the life of the device
- Eliminates die/component hotspots caused by incomplete heatsink contact seen with use of other thermal compounds
Additionally, a thermal pad requires a presssure mount with a narrow gap, while Carbon Black is designed for non-pressure-mounted components.